A new soft paste-type thermal gel from Advanced Antivibration Components features excellent thermal conductivity up to 6.5W/m • K. This RoHS controlled substance is used to fill gaps around heat sources, such as high-performance semiconductors. Other applications involve surface, underside and lead heat sources such as IC’s. The paste is most popular for use where it is difficult to fix sheet-type thermal gel. These applications include: computer internal components, power supplies, power transistors and other heat producing components.
There are three types of gels, identified as the V30Z63MDP Series, which come in a syringe for easier application. The gels feature a high specific volume resistance ratio of up to 7.2x1014 W • cm and a low dissipation factor down to 0.0004 at 1MHz. High breakdown voltage also is up to 9.6 kv/mm.
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